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SLMA002 Fiches technique(PDF) 3 Page - Texas Instruments |
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SLMA002 Fiches technique(HTML) 3 Page - Texas Instruments |
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3 / 46 page ![]() ELECTROSTATIC DISCHARGE (ESD) PROTECTION PACKAGE DISSIPATION RATINGS (1) (2) (3) TPS55383 ,, TPS55386 www.ti.com ......................................................................................................................................................................................... SLUS818 – SEPTEMBER 2008 MIN UNIT Human body model 2k CDM 1.5k V Machine Model 250 THERMAL IMPEDANCE JUNCTION-TO-THERMAL TA = +25°C TA = +85°C PACKAGE PAD (°C/W) POWER RATING (W) POWER RATING (W) Plastic 16-Pin HTSSOP (PWP) 2.07(4) 1.6 1.0 (1) For more information on the PWP package, refer to TI Technical Brief (SLMA002A). (2) TI device packages are modeled and tested for thermal performance using printed circuit board designs outlined in JEDEC standards JESD 51-3 and JESD 51-7. (3) For application information, see the Power Derating section. (4) TJ-A = +40°C/W. Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): TPS55383 TPS55386 |
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