High-Output-Drive, 10MHz, 10V/µs,

Rail-to-Rail I/O Op Amps with Shutdown in SC70

______________________________________________________________________________________

17

REV.

DOCUMENT CONTROL NO.

APPROVAL

PROPRIETARY INFORMATION

TITLE:

3.00

2.60

E

C

E1

E

BETWEEN 0.08mm AND 0.15mm FROM LEAD TIP.

8. MEETS JEDEC MO178.

8∞

0.60

1.75

0.30

L2

0∞

e1

e

L

1.50

E1

0.65 BSC.

1.95 REF.

0.25 BSC.

GAUGE PLANE

SEATING PLANE C

C

L

PIN 1

I.D. DOT

(SEE NOTE 6)

L

C

L

C

A2

e1

D

DETAIL "A"

5. COPLANARITY 4 MILS. MAX.

NOTE:

7. SOLDER THICKNESS MEASURED AT FLAT SECTION OF LEAD

6. PIN 1 I.D. DOT IS 0.3 MM ÿ MIN. LOCATED ABOVE PIN 1.

4. PACKAGE OUTLINE INCLUSIVE OF SOLDER PLATING.

3. PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH & METAL BURR.

HEEL OF THE LEAD PARALLEL TO SEATING PLANE C.

2. FOOT LENGTH MEASURED FROM LEAD TIP TO UPPER RADIUS OF

1. ALL DIMENSIONS ARE IN MILLIMETERS.

L2

L

A1

A

0.45

1.30

0.15

1.45

MAX

0.28

b

0.90

A2

0.00

A1

0.90

A

MIN

SYMBOL

3.00

0.20

2.80

D

0.09

C

SEE DETAIL "A"

L

C

b

e

D

1

21-0078

1

PACKAGE OUTLINE, SOT-23, 8L BODY

0

0

Package Information (continued)

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information

go to www.maxim-ic.com/packages.)