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LP3852 Fiches technique(PDF) 16 Page - National Semiconductor (TI) |
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LP3852 Fiches technique(HTML) 16 Page - National Semiconductor (TI) |
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16 / 19 page ![]() Application Hints (Continued) θ JA of TO-263 package for different copper area sizes, using a typical PCB with 1 ounce copper and no solder mask over the copper area for heat sinking. As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. The minimum value for θ JA for the TO-263 package mounted to a PCB is 32˚C/W. Figure 6 shows the maximum allowable power dissipation for TO-263 packages for different ambient temperatures, assuming θ JA is 35˚C/W and the maximum junction tempera- ture is 125˚C. 20031032 FIGURE 5. θ JA vs Copper (1 Ounce) Area for TO-263 package 20031033 FIGURE 6. Maximum power dissipation vs ambient temperature for TO-263 package www.national.com 16 |
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