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TDA8024AT Fiches technique(PDF) 24 Page - NXP Semiconductors |
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TDA8024AT Fiches technique(HTML) 24 Page - NXP Semiconductors |
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24 / 29 page ![]() 2004 July 12 24 Philips Semiconductors Product specification IC card interface TDA8024 14 PACKAGE OUTLINES UNIT A max. A1 A2 A3 bp cD (1) E (1) (1) eHE LLp Q Z y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 SOT136-1 X 14 28 w M θ A A1 A2 b p D HE L p Q detail X E Z c L v M A e 15 1 (A ) 3 A y 0.25 075E06 MS-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.71 0.69 0.30 0.29 0.05 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 99-12-27 03-02-19 |
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