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PCA8565 Fiches technique(PDF) 21 Page - NXP Semiconductors |
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PCA8565 Fiches technique(HTML) 21 Page - NXP Semiconductors |
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21 / 26 page ![]() Philips Semiconductors PCA8565 Real time clock/calender Product data Rev. 01 — 31 March 2003 21 of 26 9397 750 10695 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 14. Package outline Fig 20. Package outline. UNIT A1 A max. A2 A3 bp L HE Lp wy v ce D(1) E(2) Z(1) θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 0.15 0.05 0.95 0.80 0.45 0.25 0.28 0.15 3.10 2.90 3.10 2.90 0.65 5.10 4.70 0.70 0.35 6 ° 0 ° 0.1 0.1 0.1 0.94 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.70 0.40 SOT505-1 99-04-09 w M bp D Z e 0.25 14 8 5 θ A A2 A1 Lp (A3) detail X L HE E c v M A X A y 2.5 5 mm 0 scale TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1 1.10 pin 1 index |
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