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PACKAGE OUTLINE

C

1.2±0.1

10X 0.3

0.2

10X 0.5

0.4

0.8 MAX

0.05

0.00

2±0.1

2X

2

8X 0.5

A

3.1

2.9

B

3.1

2.9

(0.2) TYP

WSON - 0.8 mm max height

DSC0010B

PLASTIC SMALL OUTLINE - NO LEAD

4214926/A 07/2014

PIN 1 INDEX AREA

0.08

SEATING PLANE

(OPTIONAL)

PIN 1 ID

1

6

10

5

0.1

C A

B

0.05

C

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

0.08

0.1

C A

B

0.05

C

SCALE 4.000