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L6229D Fiches technique(PDF) 20 Page - STMicroelectronics |
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L6229D Fiches technique(HTML) 20 Page - STMicroelectronics |
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20 / 25 page ![]() L6229 20/25 Figure 27. PowerDIP24 Junction-Ambient thermal resistance versus on-board copper area. Figure 28. SO24 Junction-Ambient thermal resistance versus on-board copper area. Figure 29. Mounting the PowerSO Package. 39 40 41 42 43 44 45 46 47 48 49 1 2 3 4 5 6 7 8 9 101112 Co pper Are a is on Bo ttom Sid e Co pper Are a is on To p Si de sq . cm ºC / W On-Board Copper Area 48 50 52 54 56 58 60 62 64 66 68 123 45 6789 10 11 12 C o pp er A rea is o n T op S ide sq. cm ºC / W On-Board Copper Area Slug soldered to PCB with dissipating area Slug soldered to PCB with dissipating area plus ground layer Slug soldered to PCB with dissipating area plus ground layer contacted through via holes |
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