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74LVC3G04DP Fiches technique(PDF) 10 Page - NXP Semiconductors |
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74LVC3G04DP Fiches technique(HTML) 10 Page - NXP Semiconductors |
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10 / 13 page ![]() 9397 750 13075 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data sheet Rev. 01 — 4 May 2004 10 of 13 Philips Semiconductors 74LVC3G04 Triple inverter Fig 8. Package outline VSSOP8 UNIT A1 A max. A2 A3 bp L HE Lp wy v ce D(1) E(2) Z(1) θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.00 0.85 0.60 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.1 8 ° 0 ° 0.13 0.1 0.2 0.4 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.40 0.15 Q 0.21 0.19 SOT765-1 MO-187 02-06-07 w M bp D Z e 0.12 14 8 5 θ A2 A1 Q Lp (A3) detail X A L HE E c v M A X A y 2.5 5 mm 0 scale VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1 1 pin 1 index |
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