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TDA8922TH Fiches technique(PDF) 32 Page - NXP Semiconductors |
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TDA8922TH Fiches technique(HTML) 32 Page - NXP Semiconductors |
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32 / 36 page ![]() 2003 Mar 20 32 Philips Semiconductors Objective specification 2 × 25 W class-D power amplifier TDA8922 UNIT A2 REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 4.6 4.3 A4 1.15 0.85 A5 1.65 1.35 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. SOT411-1 98-02-20 02-04-24 0 5 10 mm scale D L L1 L2 E2 E c A4 A5 A2 m L3 E1 Q w M b p 1 d Z e 2 e e 123 j DBS23P: plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm) SOT411-1 v M D x h Eh non-concave view B: mounting base side B β e 1 bp cD(1) E(1) Z (1) de Dh LL3 m 0.75 0.60 0.55 0.35 30.4 29.9 28.0 27.5 12 2.54 12.2 11.8 10.15 9.85 1.27 e 2 5.08 2.4 1.6 Eh 6 E 1 14 13 L 1 10.7 9.9 L 2 6.2 5.8 E 2 1.43 0.78 2.1 1.8 1.85 1.65 4.3 3.6 2.8 Q j 0.25 w 0.6 v 0.03 x 45 ° β |
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