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MB9B360R Fiches technique(PDF) 157 Page - Cypress Semiconductor |
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MB9B360R Fiches technique(HTML) 157 Page - Cypress Semiconductor |
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157 / 166 page ![]() Document Number: 002-04872 Rev.*A Page 157 of 166 MB9B360R Series 100-pin plastic LQFP Lead pitch 0.50 mm Package width × package length 14.00 mm × 14.00 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold Mounting height 1.70 mm MAX Weight 0.65 g 100-pin plastic LQFP (FPT-100P-M23) (FPT-100P-M23) C 2009-2010 FUJITSU SEMICONDUCTOR LIMITED F100034S-c-3-4 16.00±0.20(.630±.008)SQ 1 25 51 76 75 100 0.50(.020) 0.22±0.05 M 0.08(.003) *14.00±0.10(.551±.004)SQ 26 50 0.145±0.055 (.006±.002) 0.08(.003) "A" INDEX 0°~8° 0.50±0.20 0.10±0.10 (Stand off) +.008 +0.20 (Mounting height) - 0.10 1.50 .059 -.004 ( ) 0.60±0.15 0.25(.010) Dimensions in mm (inches). Note:The values in parentheses are reference values. Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. Details of "A" part (.004±.004) (.009±.002) (.020±.008) (.024±.006) |
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