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CLC5523IM Fiches technique(PDF) 7 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
No de pièce CLC5523IM
Description  Low-Power, Variable Gain Amplifier
PDF  12 Pages
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Fabricant  NSC [National Semiconductor (TI)]
Site Internet  http://www.national.com
Logo NSC - National Semiconductor (TI)

CLC5523IM Fiches technique(HTML) 7 Page - National Semiconductor (TI)

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Minimizing Parasitic Effects on
Small Signal Bandwidth
The best way to minimize parasitic effects is to use the
small outline package and surface mount components.
For
designs
utilizing
through-hole
components,
specifically axial resistors, resistor self-capacitance
should be considered. Example: the average magnitude
of parasitic capacitance of RN55D 1% metal film
resistors is about 0.15pF with variations of as much as
0.1pF between lots.
Given the CLC5523’s extended
bandwidth, these small parasitic reactance variations can
cause measurable frequency response variations in the
highest octave. We therefore recommend the use
of surface mount resistors to minimize these parasitic
reactance effects. If an axial component is preferred, we
recommend PRP8351 resistors which are available from
Precision Resistive Products, Inc., Highway 61 South,
Mediapolis, Iowa.
Small Signal Response at Low Avmax
When the maximum gain, as set by Rg and Rf, is greater
than or equal to Avmax = 10, little or no peaking should be
observed in the amplifier response. When the gain range
is set to less than Avmax = 10, some peaking may
be observed at higher frequencies. At gain ranges of
2
² Avmax ² 10 peaking can be minimized by increasing
Rf.
At gain ranges of Avmax < 2 peaking reaches
approximately 6dB in the upper octave.
If peaking is observed with the recommended Rf resistor,
and a small increase in the Rf resistor does not solve the
problem, then investigate the possible causes and
remedies listed below.
s
Capacitance across Rf
s
Do not place a capacitor across Rf
s
Keep traces connecting Rf separated and as
short as possible
s
Capacitive Loads
s
Place a small resistor (20-50
W) between the
output and CL
s
Long traces and/or lead lengths between Rf
and the CLC5523
s
Keep these traces as short as possible
s
Long traces between CLC5523 and 0.1
mF
bypass capacitors
s
Keep these traces less than 0.2 inches (5mm)
s
For the devices in the PDIP package, an
additional 1000pF monolithic capacitor should be
placed less than 0.1” (3mm) from the pin
s
Extra capacitance between the Rg pin and
ground (CG)
s
See the
Printed Circuit Board Layout sub-section
below for suggestions on reducing CG
s
Increase Rf if peaking is still observed after
reducing CG
s
Non-inverting input pin connected directly to
ground
s
Place a 50 to 200
W resistor between the non-
inverting pin and ground
Adjusting Offsets and DC Level Shifting
Offsets can be broken into two parts: an input-referred term
and an output-referred term. These errors can be trimmed
using the circuit in Figure 4. First set VG to 0V and adjust
the trim pot R4 to null the offset voltage at the output. This
will eliminate the output stage offsets. Next set VG to 2V
and adjust the trim pot R1 to null the offset voltage at the
output. This will eliminate the input stage offsets.
Figure 4: Offset Adjust Circuit
CLC5523
Rf
2
3
4
1
VG
6
7
25
W
Rg
R3
10k
0.1
mF
R4
10k
-5V
+5V
Vo
Vin
R2
10k
0.1
mF
R1
10k
-5V
+5V



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