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HMC438MS8G Fiches technique(PDF) 3 Page - Hittite Microwave Corporation

No de pièce HMC438MS8G
Description  SMT GaAs HBT MMIC DIVIDE-BY-5, DC - 7.0 GHz
PDF  6 Pages
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Fabricant  HITTITE [Hittite Microwave Corporation]
Site Internet  http://www.hittite.com
Logo HITTITE - Hittite Microwave Corporation

HMC438MS8G Fiches technique(HTML) 3 Page - Hittite Microwave Corporation

  HMC438MS8G Datasheet HTML 1Page - Hittite Microwave Corporation HMC438MS8G Datasheet HTML 2Page - Hittite Microwave Corporation HMC438MS8G Datasheet HTML 3Page - Hittite Microwave Corporation HMC438MS8G Datasheet HTML 4Page - Hittite Microwave Corporation HMC438MS8G Datasheet HTML 5Page - Hittite Microwave Corporation HMC438MS8G Datasheet HTML 6Page - Hittite Microwave Corporation  
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MICROWAVE CORPORATION
10 - 98
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
10
-300
-200
-100
0
100
200
300
400
22.5
23
23.5
24
24.5
25
25.5
TIME (ns)
Output Voltage Waveform,
Pin= 0 dBm, Fout= 882 MHz, T= 25 °C
Absolute Maximum Ratings
Outline Drawing
Typical Supply Current vs. Vcc
Note: Divider will operate over full voltage range shown above
RF Input (Vcc= +5V)
+13 dBm
Vcc
+5.5V
Maximum Channel Temperature
135 °C
Continuous Pdiss (T=85 °C)
(derate 11.3mW/°C above 92 °C)
485mW
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Vcc (V)
Icc (mA)
4.75
75
5.0
80
5.25
87
DC blocking capacitors are required at RF input and RF output ports.
Choose value for lowest frequency of operation.
HMC438MS8G
SMT GaAs HBT MMIC
DIVIDE-BY-5, DC - 7.0 GHz
v01.1002
NOTES:
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEADFRAME MATERIAL: COPPER ALLOY
3. LEADFRAME PLATING: Sn/Pb SOLDER
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
7. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.



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