SP6832EKSLASHTR datasheet(12/15 Pages) SIPEX

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SP6832DS/04

SP6832 High Speed, High Efficiency Voltage Inverter

Combining a Doubler and Inverter Circuit

A designer can connect a SP6832 device in a

combination doubler/inverter circuit as seen in

Figure 19. The doubler uses capacitors C3 and

C4 while the inverter uses C1 and C2. Loading

either output decreases both output voltages to

GND because both the doubler and the inverter

circuits use the charge pump. Designers should

not allow the total current output from the

doubler and the inverter to exceed 40mA.

Implementing Shutdown

If shutdown control of the SP6832 devices is

necessary, the circuit found in Figure 20 can be

implemented. The 0.1

µF capacitor at IN absorbs

transient input currents. The output resistance of

the devices can be determined by the following

equation:

OUT = 20 + 2 x RBUFFER ,

where R

OUT is the output resistance and RBUFFER

is the output resistance of the buffer driving IN.

BUFFER can be reduced by connecting multiple

buffers in parallel at IN. The polarity of the

SHUTDOWN signal can be changed by using a

noninverting buffer to drive IN.

Connecting in Parallel

A designer can parallel a number of SP6832

devices to reduce the output resistance for

specific designs. All devices will need their own

flying capacitor, C1, but a single output capacitor

will serve all of the devices connected in

parallel by increasing the capacitance of C2 by

a factor of n where n equals the total number

of devices connected. This connection can be

found in Figure 21.

Cascading Devices

A designer can cascade SP6832 devices to

produce a larger inverted voltage output. Refer

to Figure 22 for this circuit connection. With

two cascaded devices, the unloaded output

voltage is decreased by the output resistance of

the first device multiplied by the quiescent

current of the second device connected. The total

output resistance is greatly increased when

more than two devices are cascaded.

Layout and Grounding

Designers should make an effort to minimize

noise by paying special attention to the

circuit layout with the SP6832 devices.

External components should be connected in

close proximity to the device and a ground

plane should be implemented. This will keep

electrical traces short minimizing parasitic

inductance and capacitance.

Figure 20. SP6832 Device with Shutdown Control

OUT

SP6832

C1+

C1-

GND

+VIN

VOUT

CIN

0.1

µF

Shutdown

Logic

OFF

SP6832EK/TR Fiches technique(PDF) 12 Page - Sipex Corporation

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