20

36-00-01-001

Ver. 1.1.0

Aeroflex Microelectronics Solutions - HiRel

ORDERING INFORMATION

2M x 48 SSRAM

Package Option

Associated Lead Finish Option

(Z) 288-CLGA

(C) Gold

(S) 288-CCGA

(A) Hot Solder Dipped

(C) 288-CBGA

(A) Hot Solder Dipped

Lead Finish: (Note 1)

(C) = Gold

(A) = Solder

Screening: (Notes 2, 3)

(F) = HiRel Flow (Temperature Range: -55

°C to +105°C) (In development, contact factory)

Package Type:

(Z) = 288-Lead Ceramic Land Grid Array (CLGA)

(S) = 288 Lead Ceramic Column Grid Array (CCGA)

(C) = 288 Lead Ceramic Ball Grid Array (CBGA)

Access Time:

(M) = 133MHz Maximum Frequency

Device Type:

(8SP2M48) = 2Mbit x 48 SSRAM Device

Notes:

1. Lead finish is per the table below.

3. HiRel flow per Aeroflex Manufacturing Flows Document. Radiation is neither tested nor guaranteed.

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