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STM32F401CC Fiches technique(PDF) 62 Page - STMicroelectronics |
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STM32F401CC Fiches technique(HTML) 62 Page - STMicroelectronics |
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62 / 134 page ![]() Electrical characteristics STM32F401xB STM32F401xC 62/134 DocID024738 Rev 5 6.3.4 Operating conditions at power-up / power-down (regulator OFF) Subject to general operating conditions for TA. Note: This feature is only available for UFBGA100 package. 6.3.5 Embedded reset and power control block characteristics The parameters given in Table 19 are derived from tests performed under ambient temperature and VDD supply voltage @ 3.3V. Table 18. Operating conditions at power-up / power-down (regulator OFF)(1) 1. To reset the internal logic at power-down, a reset must be applied on pin PA0 when VDD reach below 1.08 V. Symbol Parameter Conditions Min Max Unit tVDD VDD rise time rate Power-up 20 ∞ µs/V VDD fall time rate Power-down 20 ∞ tVCAP VCAP_1 and VCAP_2 rise time rate Power-up 20 ∞ VCAP_1 and VCAP_2 fall time rate Power-down 20 ∞ Table 19. Embedded reset and power control block characteristics Symbol Parameter Conditions Min Typ Max Unit VPVD Programmable voltage detector level selection PLS[2:0]=000 (rising edge) 2.09 2.14 2.19 V PLS[2:0]=000 (falling edge) 1.98 2.04 2.08 PLS[2:0]=001 (rising edge) 2.23 2.30 2.37 PLS[2:0]=001 (falling edge) 2.13 2.19 2.25 PLS[2:0]=010 (rising edge) 2.39 2.45 2.51 PLS[2:0]=010 (falling edge) 2.29 2.35 2.39 PLS[2:0]=011 (rising edge) 2.54 2.60 2.65 PLS[2:0]=011 (falling edge) 2.44 2.51 2.56 PLS[2:0]=100 (rising edge) 2.70 2.76 2.82 PLS[2:0]=100 (falling edge) 2.59 2.66 2.71 PLS[2:0]=101 (rising edge) 2.86 2.93 2.99 PLS[2:0]=101 (falling edge) 2.65 2.84 2.92 PLS[2:0]=110 (rising edge) 2.96 3.03 3.10 PLS[2:0]=110 (falling edge) 2.85 2.93 2.99 PLS[2:0]=111 (rising edge) 3.07 3.14 3.21 PLS[2:0]=111 (falling edge) 2.95 3.03 3.09 VPVDhyst(2) PVD hysteresis - 100 - mV VPOR/PDR Power-on/power-down reset threshold Falling edge 1.60(1) 1.68 1.76 V Rising edge 1.64 1.72 1.80 |
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