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M95040-DRMN8TP Fiches technique(PDF) 35 Page - STMicroelectronics |
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M95040-DRMN8TP Fiches technique(HTML) 35 Page - STMicroelectronics |
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35 / 39 page ![]() DocID027516 Rev 1 35/39 M95040-DRE Package mechanical data 38 Figure 23. WFDFPN8 (MLP8) – 8-lead very thin fine pitch dual flat package no lead 2 x 3 mm, 0.5 mm, package outline 1. Drawing is not to scale. 2. The central pad (the area E2 by D2 in the above illustration) must be either connected to Vss or left floating (not connected) in the end application. |
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