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L6984 Fiches technique(PDF) 32 Page - STMicroelectronics |
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L6984 Fiches technique(HTML) 32 Page - STMicroelectronics |
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32 / 34 page ![]() Package information L6984 32/34 DocID025378 Rev 3 Figure 23. VDFPN10 3 x 3 x 1.0 mm package outline 1. The pin #1 identifier must be existed on the top surface of the package by using indentation mark or other feature of package body. Exact shape and size of this feature is optional. Table 11. VDFPN10 3 x 3 x 1.0 mm mechanical data Symbol Dimensions (mm) Note Min. Typ. Max. A 0.80 0.90 1.00 (1) 1. VFDFPN stands for “Thermally Enhanced Very thin Fine pitch Dual Flat Packages No lead”. Very thin: 0.80 mm < A . 1.00 mm / fine pitch: e < 1.00 mm. A1 0.02 0.05 A2 0.55 0.65 0.80 A3 0.20 b 0.18 0.25 0.30 D 2.85 3.00 3.15 D2 2.20 2.70 E 2.85 3.00 3.15 E2 1.40 1.75 e 0.50 L 0.30 0.40 0.50 ddd 0.08 |
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