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M24M02-DRMN6TP Fiches technique(PDF) 32 Page - STMicroelectronics |
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M24M02-DRMN6TP Fiches technique(HTML) 32 Page - STMicroelectronics |
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32 / 38 page ![]() Package mechanical data M24M02-DR 32/38 DocID18204 Rev 8 Figure 16. SO8N – 8-lead plastic small outline, 150 mils body width, package recommended footprint 1. Dimensions are expressed in millimeters. 9.2 WLCSP package information Figure 17. WLCSP- 8-bump, 3.556 x 2.011 mm, wafer level chip scale package outline 1. Drawing is not to scale. 2. Primary datum Z and seating plane are defined by the spherical crowns of the bump. |
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