LMP7300MM datasheet(4/30 Pages) TI1

4 / 30 page

LMP7300

SNOSAT7G – AUGUST 2007 – REVISED OCTOBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN differential

±VS

Supply voltage (VS = V

+ – V−)

13.6

Voltage at input/output pins

V+ + 0.3

V−

− 0.3

Infrared or convection (20 s)

235

°C

Soldering information

Wave soldering lead temperature (10 s)

260

°C

Junction temperature, TJ

(3)

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-

V(ESD)

Electrostatic discharge

±250

C101(2)

Machine model

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

Temperature(2)

–40

125

°C

Supply Voltage (VS = V

+ – V−)

2.7

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics Tables.

(2)

The maximum power dissipation is a function of TJ(MAX),

θJA. The maximum allowable power dissipation at any ambient temperature

is PD = (TJ(MAX) – TA)/

θJA. All numbers apply for packages soldered directly onto a PC Board.

6.4 Thermal Information

LMP7300

THERMAL METRIC(1)

DGK (VSSOP)

D (SOIC)

UNIT

8 PINS

RθJA

Junction-to-ambient thermal resistance(2)

175.5

121.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

66.1

67.5

°C/W

RθJB

Junction-to-board thermal resistance

95.6

61.5

°C/W

ψJT

Junction-to-top characterization parameter

18.3

°C/W

ψJB

Junction-to-board characterization parameter

94.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953..

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

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