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MBR860MFS Fiches technique(PDF) 3 Page - ON Semiconductor |
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MBR860MFS Fiches technique(HTML) 3 Page - ON Semiconductor |
3 / 4 page ![]() MBR860MFS, NRVB860MFS http://onsemi.com 3 TYPICAL CHARACTERISTICS Figure 5. Typical Junction Capacitance Figure 6. Current Derating TO−220AB VR, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE (°C) 60 50 40 30 20 10 0 10 100 1,000 180 160 140 120 100 80 60 0 2 4 6 8 12 14 16 Figure 7. Forward Power Dissipation IF(AV), AVERAGE FORWARD CURRENT (A) 4 3 2 1 0 0 1 2 3 5 6 7 8 Figure 8. Thermal Response PULSE TIME (sec) 0.01 0.001 10 0.0001 100 0.00001 1,000 0.000001 0.001 0.01 0.1 1 10 100 TJ = 25°C 10 RqJC = 2.0°C/W Square Wave dc TJ = 175°C 4 Square Wave dc IPK/IAV = 20 IPK/IAV = 10 IPK/IAV = 5 1 0.1 Single Pulse 50% Duty Cycle 20% 10% 5% 2% 1% Assumes 25 °C ambient and soldered to a 600 mm2 − oz copper pad on PCB |
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