| Moteur de recherche de fiches techniques de composants électroniques |
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100331 Fiches technique(PDF) 4 Page - National Semiconductor (TI) |
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100331 Fiches technique(HTML) 4 Page - National Semiconductor (TI) |
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4 / 8 page ![]() AC Electrical Characteristics V EE = −4.2V to −5.7V, VCC = VCCA = GND Symbol Parameter T C = −55˚C T C = +25˚C T C = +125˚C Units Conditions Notes Min Max Min Max Min Max f max Toggle Frequency 400 400 400 MHz Figures 2, 3 (Note 10) t PLH Propagation Delay 0.50 2.20 0.60 2.00 0.50 2.40 ns t PHL CP C to Output Figures 1, 3 t PLH Propagation Delay 0.50 2.20 0.60 2.00 0.50 2.40 ns t PHL CP n to Output t PLH Propagation Delay 0.50 2.20 0.60 2.00 0.50 2.40 CP n,CPC = L Figures 1, 4 (Notes 7, 8, 9) t PHL CD n,SDn to Output ns t PLH 0.50 2.40 0.60 2.10 0.50 2.50 CP n,CPC = H t PHL t PLH Propagation Delay 0.70 2.70 0.80 2.60 0.80 2.90 CP n,CPC = L t PHL MS, MR to Output ns t PLH 0.70 2.90 0.80 2.80 0.80 3.10 CP n,CPC = H t PHL t TLH Transition Time 0.20 1.40 0.20 1.40 0.20 1.40 ns Figures 1, 3, 4 t THL 20% to 80%,80% to 20% t s Setup Time Figure 5 (Note 10) D n 1.00 0.80 0.90 CD n,SDn (Release Time) 1.50 1.30 1.60 ns Figure 4 MS, MR (Release Time) 2.50 2.30 2.50 t h Hold Time D n 1.50 1.30 1.60 ns Figure 5 t pw(H) Pulse Width HIGH CP n,CPC,CDn, 2.00 2.00 2.00 ns Figures 3, 4 SD n, MR, MS Note 7: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals −55˚C), then testing immediately without allowing for the junction temperature to stabilize due to heat dissipation after power-up. This provides “cold start” specs which can be considered a worst case condition at cold temperatures. Note 8: Screen tested 100% on each device at +25˚C. Temperature only, Subgroup A9. Note 9: Sample tested (Method 5005, Table I) on each Mfg. lot at +25˚C, Subgroup A9, and at +125˚C, and −55˚C Temp., Subgroups A10 and A11. Note 10: Not tested at +25˚C, +125˚C and −55˚C Temperature (design characterization data). www.national.com 4 |
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