1

2

3

4

8

7

6

5

IN+

NC

V+

OUT

IN-

GND

PRE OUT

BUF IN

INA271

AHD OR HKJ PACKAGE

(TOP VIEW)

NC denotes no internal connection

8

5

4

1

HKQ as formed or HKJ mounted dead bug

HKQ PACKAGE

(TOP VIEW)

IN-

GND

PRE OUT

BUF IN

IN+

NC

V+

OUT

INA271-HT

www.ti.com

SBOS521D – SEPTEMBER 2010 – REVISED AUGUST 2013

PIN CONFIGURATION

ORDERABLE PART NUMBER

TOP-SIDE MARKING

–55°C to 175°C

AHD

INA271AHD

INA271AHD

INA271SKGD1

KGD (bare die)

NA

INA271SKGD2

–55°C to 210°C

HKJ

INA271SHKJ

INA271SHKJ

HKQ

INA271SHKQ

INA271SHKQ

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

ABSOLUTE MAXIMUM RATINGS

(1)

UNIT

+18

V

–18 to +18

V

Common-Mode

–16 to +80

V

Analog Output:

OUT and PRE OUT Pins

GND – 0.3 to (V+) + 0.3

V

Input Current Into Any Pin

5

mA

Operating Temperature

–55 to +210

°C

Storage Temperature

–65 to +210

°C

Junction Temperature

+210

°C

ESD Ratings:

Human Body Model

3000

V

Charged-Device Model

750

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

THERMAL CHARACTERISTICS FOR HKJ OR HKQ PACKAGE

over operating free-air temperature range (unless otherwise noted)

PARAMETER

MIN

TYP

MAX

UNIT

to ceramic side of case

5.7

Junction-to-case thermal resistance

°C/W

to top of case lid (metal side of case)

13.7

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