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Vishay Dale Thin Film

Revision: 07-Aug-14

3

Document Number: 60093

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

TYPICAL HIGH FREQUENCY PERFORMANCE ELECTRICAL MODEL AND TESTING

The lumped circuit above was used to model the data at the bonding pad-resistor reference plane. High frequency testing was

performed by Modelithics, Inc. on parts mounted to quartz test boards. Quartz test boards were chosen to minimize the

contribution of the board effects at high frequencies.

INTERNAL IMPEDANCE

Lumped Equivalent Circuit

Reference plane is at the resistor-bonding pad interface.

C: Internal shunt capacitance

L : Internal inductance

R: Resistance

L

C

C

g

C

g

L

C

R

L

C

L

C

0402 Wraparound

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

Frequency (GHz)

0402 Flip chip

75

Ω

100

Ω

250

Ω

500

Ω

50

Ω

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

Frequency (GHz)

0603 Flip chip

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0.1

1

10

Frequency (GHz)

0.1

1

10

0.1

1

10

C = 0.0262 pF

L = 0.00189 nH

C = 0.0403 pF

L = 0.0267 nH

C = 0.0392 pF

L = 0.1209 nH

1000

Ω

100

Ω

250

Ω

500

Ω

50

Ω

1000

Ω

75

Ω

100

Ω

500

Ω

50

Ω

1000

Ω