www.ti.com

PACKAGE OUTLINE

C

TYP

6.6

6.2

1.1 MAX

26X 0.65

28X 0.30

0.19

2X

8.45

TYP

0.20

0.09

0 - 8

0.10

0.02

5.65

5.25

3.15

2.75

(1)

0.25

GAGE PLANE

0.7

0.5

A

NOTE 3

9.8

9.6

B

NOTE 4

4.5

4.3

4214870/A 10/2014

PowerPAD - 1.1 mm max height

PWP0028A

PLASTIC SMALL OUTLINE

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm, per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.

5. Reference JEDEC registration MO-153, variation AET.

PowerPAD is a trademark of Texas Instruments.

TM

1

28

0.1

C A

B

15

14

PIN 1 ID

AREA

SEATING PLANE

0.1 C

SEE DETAIL A

DETAIL A

TYPICAL

SCALE 1.800

THERMAL

PAD