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CS3750 Fiches technique(PDF) 4 Page - ON Semiconductor |
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CS3750 Fiches technique(HTML) 4 Page - ON Semiconductor |
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4 / 4 page ![]() Part Number Description CS3750ENF16 16L PDIP (internally fused leads) 4 Thermal Data 16L PDIP (internally fused leads) RΘJC typ 15 °C/W RΘJA typ 50 °C/W Package Specification PACKAGE DIMENSIONS IN mm (INCHES) Ordering Information PACKAGE THERMAL DATA D Lead Count Metric English Max Min Max Min 16L PDIP 19.69 18.67 .775 .735 (internally fused leads) ON Semiconductor and the ON Logo are trademarks of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor reserves the right to make changes without further notice to any products herein. For additional infor- mation and the latest available information, please contact your local ON Semiconductor representative. © Semiconductor Components Industries, LLC, 2000 Plastic DIP (N); 300 mil wide 0.39 (.015) MIN. 2.54 (.100) BSC 1.77 (.070) 1.14 (.045) D Some 8 and 16 lead packages may have 1/2 lead at the end of the package. All specs are the same. .203 (.008) .356 (.014) REF: JEDEC MS-001 3.68 (.145) 2.92 (.115) 8.26 (.325) 7.62 (.300) 7.11 (.280) 6.10 (.240) .356 (.014) .558 (.022) |
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