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STSC1 Fiches technique(PDF) 10 Page - List of Unclassifed Manufacturers |
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STSC1 Fiches technique(HTML) 10 Page - List of Unclassifed Manufacturers |
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10 / 13 page ![]() www.sensirion.com Version 1 – May 2014 9/13 10.2 Metal Land Pattern Figure 9 Recommended metal land pattern for STSC1 (all dimensions are in mm). Recommended solder paste stencil thickness is 100µm, pads on PCB are recommended to be non solder mask defined (NSMD). 10.3 Tape and Reel Package Figure 10 Technical drawing of the packaging tape with sensor orientation in tape. Header tape is to the right and trailer tape to the left on this drawing. Dimensions are given in millimeters. |
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