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PIC16LC554 Fiches technique(PDF) 67 Page - Microchip Technology |
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PIC16LC554 Fiches technique(HTML) 67 Page - Microchip Technology |
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67 / 96 page ![]() © 1997 Microchip Technology Inc. Preliminary DS40143B-page 67 PIC16C55X(A) 10.0 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings † Ambient Temperature under bias ............................................................................................................. –40 ° to +125°C Storage Temperature................................................................................................................................ –65 ° to +150°C Voltage on any pin with respect to VSS (except VDD and MCLR)...................................................... –0.6V to VDD +0.6V Voltage on VDD with respect to VSS ............................................................................................................... 0 to +7.5V Voltage on MCLR with respect to VSS (Note 2)................................................................................................. 0 to +14V Total power Dissipation (Note 1) ...............................................................................................................................1.0W Maximum Current out of VSS pin...........................................................................................................................300 mA Maximum Current into VDD pin..............................................................................................................................250 mA Input Clamp Current, IIK (VI<0 or VI> VDD) ...................................................................................................................... ±20 mA Output Clamp Current, IOK (V0 <0 or V0>VDD) ............................................................................................................... ±20 mA Maximum Output Current sunk by any I/O pin ........................................................................................................25 mA Maximum Output Current sourced by any I/O pin ...................................................................................................25 mA Maximum Current sunk by PORTA and PORTB ...................................................................................................200 mA Maximum Current sourced by PORTA and PORTB ..............................................................................................200 mA Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOl x IOL) † NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. |
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