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TC1307 Fiches technique(PDF) 7 Page - Microchip Technology |
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TC1307 Fiches technique(HTML) 7 Page - Microchip Technology |
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7 / 28 page ![]() 2002 Microchip Technology Inc. DS21702A-page 7 TC1307 Note: Unless otherwise indicated, VIN = 3.8V, CIN = 10 µF ceramic (X5R), COUT = 1 µF ceramic (X5R), ILOAD = 100 µA, SELECT12 = NC, SELECT34 = VIN, SHDN1/2/3/4 = VIN, TA = 25°C. Junction temperature (TJ) is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the Ambient temperature is not significant. FIGURE 2-13: Dropout Voltage vs. Load Current. FIGURE 2-14: Dropout Voltage vs. Load Current. FIGURE 2-15: Crosstalk Characteristics VOUT1, VOUT2 and VOUT3. FIGURE 2-16: Crosstalk Characteristics VOUT1, VOUT2, and VOUT3. FIGURE 2-17: Crosstalk Characteristics VOUT1, VOUT2, and VOUT3. FIGURE 2-18: Crosstalk Characteristics VOUT1, VOUT2, and VOUT3. 0.000 0.020 0.040 0.060 0.080 0.100 0.120 0.140 0.160 0 25 50 75 100 125 150 Load Current (mA) TJ = -40°C TJ = +25°C TJ = +125°C VOUT = 2.8V 0.000 0.020 0.040 0.060 0.080 0.100 0.120 0.140 0 25 50 75 100 125 150 Load Current (mA) TJ = +40°C TJ = +25°C TJ = +125°C VOUT = 3.0V |
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