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LM4819MMX/NOPB Fiches technique(PDF) 2 Page - Texas Instruments |
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LM4819MMX/NOPB Fiches technique(HTML) 2 Page - Texas Instruments |
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2 / 27 page ![]() LM4819, LM4819MBD SNAS133D – FEBRUARY 2001 – REVISED MARCH 2013 www.ti.com Top View Top View Figure 2. Small Outline (SOIC) Package Figure 3. Mini Small Outline (VSSOP) Package See Package Number D0008A See Package Number DGK0008A Top View Figure 4. WSON Package See Package Number NGL0008B These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: LM4819 LM4819MBD |
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