BAS40_15 datasheet(14/22 Pages) PHILIPS

No de pièce	BAS40

Description	General-purpose Schottky diodes

PDF	22 Pages

Scroll/Zoom	100%

Fabricant	PHILIPS [NXP Semiconductors]

Site Internet	http://www.nxp.com

Logo

14 / 22 page

BAS40_1PSXXSB4X_SER

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 9 — 18 March 2015

14 of 22

NXP Semiconductors

BAS40 series; 1PSxxSB4x series

General-purpose Schottky diodes

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 20. Reflow soldering footprint SOD123F

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 21. Reflow soldering footprint SOD882

1.6

2.9

4.4

1.1 1.2

2.1

1.1

×)

solder lands

solder resist

occupied area

solder paste

mbl872

1.30

0.30

R = 0.05 (8

×)

R = 0.05 (8

×)

0.60

×)

0.70

×)

0.80

×)

0.90

0.30

×)

0.40

×)

0.50

×)

solder lands

solder resist

occupied area

solder paste

BAS40 Fiches technique(PDF) 14 Page - NXP Semiconductors

BAS40 Fiches technique(HTML) 14 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22

Fiches technique Télécharger

Lien URL