HFS740 datasheet(4/7 Pages) SEMIHOW

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Typical Characteristics (continued)

Figure 7. Breakdown Voltage Variation

vs Temperature

Figure 8. On-Resistance Variation

vs Temperature

Figure 9. Maximum Safe Operating Area

Figure 10. Maximum Drain Current

vs Case Temperature

Figure 11. Transient Thermal Response Curve

Figure 7. Breakdown Voltage Variation

vs Temperature

Figure 8. On-Resistance Variation

vs Temperature

Figure 9. Maximum Safe Operating Area

Figure 10. Maximum Drain Current

vs Case Temperature

Figure 11. Transient Thermal Response Curve

100

125

150

C, Case Temperature [

oC]

-2

-1

10 s

100 ms

10 ms

1 ms

100 s

Operation in This Area

is Limited by R

DS(on)

* Notes :

1. T

C = 25

2. T

J = 150

3. Single Pulse

DS, Drain-Source Voltage [V]

-5

-4

-3

-2

-1

-2

-1

* Notes :

1. Z

JC(t) = 2.86

oC/W Max.

2. Duty Factor, D=t

1/t2

3. T

JM - TC = PDM * Z JC(t)

single pulse

D=0.5

0.02

0.2

0.05

0.1

0.01

1, Square Wave Pulse Duration [sec]

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