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LTC1347CS Fiches technique(PDF) 7 Page - Linear Technology |
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LTC1347CS Fiches technique(HTML) 7 Page - Linear Technology |
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7 / 8 page ![]() 7 LTC1347 PACKAGE DESCRIPTION 0.505 – 0.560 (12.827 – 14.224) 1.455 (36.957) MAX 12 3 4 5 6 7 8 9 10 27 19 20 21 22 24 23 25 26 28 11 12 13 14 15 16 17 18 0.009 – 0.015 (0.229 – 0.381) 0.625 +0.025 –0.015 +0.635 –0.381 15.87 () 0.600 – 0.625 (15.240 – 15.875) 0.070 (1.778) TYP 0.015 (0.381) MIN 0.125 (3.175) MIN 0.130 ± 0.005 (3.302 ± 0.127) 0.018 ± 0.003 (0.457 ± 0.076) 0.035 – 0.080 (0.889 – 2.032) 0.100 ± 0.010 (2.540 ± 0.254) 0.045 – 0.065 (1.143 – 1.651) 0° – 8° TYP NOTE 1 0.009 – 0.013 (0.229 – 0.330) 0.016 – 0.050 (0.406 – 1.270) 0.291 – 0.299 (7.391 – 7.595) (NOTE 2) × 45° 0.010 – 0.029 (0.254 – 0.737) 0.005 (0.127) RAD MIN 0.037 – 0.045 (0.940 – 1.143) 0.004 – 0.012 (0.102 – 0.305) 0.093 – 0.104 (2.362 – 2.642) 0.050 (1.270) TYP 0.014 – 0.019 (0.356 – 0.482) NOTE 1 0.697 – 0.712 (17.70 – 18.08) (NOTE 2) 0.394 – 0.419 (10.007 – 10.643) 1 23 4 5 6 78 9 10 11 12 14 13 25 26 22 21 20 19 18 17 16 15 23 24 27 28 NOTE: 1. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS. THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS. 2. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 INCH (0.15mm). S Package 28-Lead Plastic SOL G Package 28-Lead SSOP 0.301 – 0.311 (7.65 – 7.90) 12 3 4 5 6 7 8 9 10 11 12 14 13 0.397 – 0.407* (10.07 – 10.33) 25 26 22 21 20 19 18 17 16 15 23 24 27 28 0.045 (1.14) 0.045 (1.14) 0.068 – 0.078 (1.73 – 1.99) 0.002 – 0.008 (0.05 – 0.21) 0.0256 (0.65) BSC 0.010 – 0.015 (0.25 – 0.38) 0.005 – 0.009 (0.13 – 0.22) 0° – 8° 0.022 – 0.037 (0.55 – 0.95) 0.205 – 0.212* (5.20 – 5.38) *THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 INCH (0.15mm). N Package 28-Lead Plastic DIP Dimensions in inches (millimeters) unltess otherwise noted. Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. |
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