9

LT1222

Dimensions in inches (millimeters) unless otherwise noted.

H8 Package

8-Lead TO-5 Metal Can

NOTE: LEAD DIAMETER IS UNCONTROLLED BETWEEN

THE REFERENCE PLANE AND SEATING PLANE.

0.050

(1.270)

MAX

0.016 – 0.021

(0.406 – 0.533)

0.010 – 0.045

(0.254 – 1.143)

SEATING

PLANE

0.040

(1.016)

MAX

0.165 – 0.185

(4.191 – 4.699)

GAUGE

PLANE

REFERENCE

PLANE

0.500 – 0.750

(12.700 – 19.050)

0.305 – 0.335

(7.747 – 8.509)

0.335 – 0.370

(8.509 – 9.398)

DIA

H8(5) 0592

0.200 – 0.230

(5.080 – 5.842)

BSC

0.027 – 0.045

(0.686 – 1.143)

0.027 – 0.034

(0.686 – 0.864)

0.110 – 0.160

(2.794 – 4.064)

INSULATING

STANDOFF

45°TYP

J8 Package

8-Lead Ceramic Dip

J8 0694

0.014 – 0.026

(0.360 – 0.660)

0.200

(5.080)

MAX

0.015 – 0.060

(0.381 – 1.524)

0.125

3.175

MIN

0.100 ± 0.010

(2.540 ± 0.254)

0.300 BSC

(0.762 BSC)

0.008 – 0.018

(0.203 – 0.457)

0° – 15°

0.385 ± 0.025

(9.779 ± 0.635)

0.005

(0.127)

MIN

0.405

(10.287)

MAX

0.220 – 0.310

(5.588 – 7.874)

12

3

4

87

65

0.025

(0.635)

RAD TYP

0.045 – 0.068

(1.143 – 1.727)

FULL LEAD

OPTION

0.023 – 0.045

(0.584 – 1.143)

HALF LEAD

OPTION

CORNER LEADS OPTION

(4 PLCS)

0.045 – 0.068

(1.143 – 1.727)

NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE OR TIN PLATE LEADS.