| Moteur de recherche de fiches techniques de composants électroniques |
|
TN1171 Fiches technique(PDF) 21 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
TN1171 Fiches technique(HTML) 21 Page - STMicroelectronics |
|
21 / 26 page ![]() DocID026092 Rev 3 21/26 TN1171 X-Ray inspections 26 12 X-Ray inspections X-ray is one way to detect solder shorts underneath the DFN package. X-rays transmitted from the X-ray tube are absorbed by the components in proportion to their density. In this case, a solder joint having a higher density absorbs most of the X-rays, and the resultant X- ray intensity is detected and interpreted in a gray scale image. The X-ray image is also a good instrument to view solder voids in the exposed pad region. |
|
Lien URL |
| ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Lien vers la fiche technique | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |