13

LT1521/LT1521-3

LT1521-3.3/LT1521-5

1521335fb

Table 4. Fault Conditions

INPUT PIN

SHDN PIN

OUTPUT/SENSE PINS

RESULTING CONDITIONS

Open (High)

Reverse Output Current

≈ 5µA (See Figure 3)

Input Current

≈ 1µA (See Figure 4)

Grounded

Reverse Output Current

≈ 5µA (See Figure 3)

Input Current

≈ 1µA (See Figure 4)

Open

Open (High)

> 1V

Reverse Output Current

≈ 5µA (See Figure 3)

Open

Grounded

> 1V

Reverse Output Current

≈ 5µA (See Figure 3)

≤ 0.8V

Open (High)

≤ 0V

Output Current = 0

≤ 0.8V

Grounded

≤ 0V

Output Current = 0

> 1.5V

Open (High)

≤ 0V

Output Current = Short-Circuit Current

Grounded

≤ 0V

Output Current = 0

MSOP (MS8) 1001

0.53

± 0.015

(.021

± .006)

SEATING

PLANE

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.18

(.077)

0.254

(.010)

1.10

(.043)

MAX

0.22 – 0.38

(.009 – .015)

0.13

± 0.05

(.005

± .002)

0.86

(.034)

REF

0.65

(.0256)

BCS

0

° – 6° TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

12

3

4

4.88

± 0.1

(.192

± .004)

8

7 6 5

3.00

± 0.102

(.118

± .004)

(NOTE 3)

3.00

± 0.102

(.118

± .004)

NOTE 4

0.52

(.206)

REF

5.23

(.206)

MIN

3.2 – 3.45

(.126 – .136)

0.889

± 0.127

(.035

± .005)

RECOMMENDED SOLDER PAD LAYOUT

0.42

± 0.04

(.0165

± .0015)

TYP

0.65

(.0256)

BSC

MS8 Package

8-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1660)