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AN2035 Fiches technique(PDF) 6 Page - STMicroelectronics |
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AN2035 Fiches technique(HTML) 6 Page - STMicroelectronics |
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6 / 11 page ![]() AN2035 - Application note 6/11 The beneficial effects of the 150°C bake can be seen in the whisker test results shown in Figure 3. Regardless of the plating thickness none of the samples had grown whiskers after 400 days of storage at room temperature. Figure 3. Protection by post-bake treatment (1 hour at 150°C) Figure 4. Protection by thickness The above whisker mitigation techniques have been agreed with all subcontractors and are therefore applied to all ST products. A “Whisker Risk Free” coating does not develop whiskers that can impact electrical performance, or component reliability. The E4 have chosen 50µm as the maximum whisker length at the end of the device life (at the end of whisker assessment tests). Time (in days) 1.82µm 3.5µm 5.35µm 7.10µm 10.10µm Time (in days) |
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