µPD3728

21

DATA SHEET S13878EJ1V0DS00

NOTES ON THE USE OF THE PACKAGE

The application of an excessive load to the package may cause the package to warp or break, or cause chips to

come off internally. Particular care should be taken when mounting the package on the circuit board.

When mounting the package, use a circuit board which will not subject the package to bending stress, or use a

socket.

however, on the inside portion as viewed from the face on which the window (glass) is bonded to the package body

(ceramic).

Note

Three-point bending strength test

Distance between supports: 70 mm, Support R: R 2 mm, Loading rate: 0.5 mm / min.

Load

Load

70 mm

70 mm