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AN2783 Fiches technique(PDF) 21 Page - STMicroelectronics |
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AN2783 Fiches technique(HTML) 21 Page - STMicroelectronics |
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21 / 47 page ![]() AN2783 PoE section 21/47 8.6 AUXI input The PM8800 reference board accepts auxiliary power sources applied before the hot-swap MOSFET as low as 18 V (16 V seen at the pin VIN of device). To do so and change the UVLO levels, the AUXI pin must be pulled up above 2 V with a current greater than 70 µA. The AUXI pin can be connected to the auxiliary voltage through a diode. In this case the current flowing into the pin is internally limited to about 300 µA. Depending on the output current drawn, the real operative AUXI voltage can be higher than the above mentioned value, basically due to the DC current limitation which is maximum input power at minimum applied on AUXI = 16V x 800 mA =12.8 W. Another limitation on the operative AUXI voltage can be the power transformer, not designed to work with a wide input voltage range for the maximum output power. 8.7 AUXII input PM8800 can also accept auxiliary power sources applied after the hot-swap MOSFET as slow as 12 V (9 V seen at the pins of device). In this case there is no current limitation and an external circuit is recommended in order to limit the inrush current. On the PM8800 reference board an active switch is implemented with a P-channel power MOSFET, capable of limiting the inrush current at startup and with very low ohmic drop during operation. AUXII prevalence over PoE can be programmed forcing a current higher than 100 µA in pin AUXII of PM8800. In this case the PD is always powered from AUXII power source because the interface circuits and the hot-swap MOSFET are forced in an off state. The pin can be connected to the auxiliary voltage through a diode. In this configuration the current flowing into the pin is internally limited to about 250 µA. AUXII can be conveniently used in case of high-power PDs requiring input power higher than the 12.95 W specified in the IEEE802.3af standard. Please note that having the hot-swap MOSFET in an off state means having the IC substrate in high impedance with GND. It is strongly recommended to move the signature capacitor of 100 nF from the C1 position to C36. This capacitor is placed between VSS and GND, implementing a low-impedance circuit at high frequency across the hot-swap MOSFET, assuring a good HF connection of the IC substrate. The PM8800 reference board is preset for AUXII prevalence over PoE, having R23 set to 10 k Ω. Warning: In case of AUXII low input voltage sources, the condition VIN < VCC must be avoided because of possible damage to the device. |
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