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OP420 Fiches technique(PDF) 4 Page - Analog Devices

No de pièce OP420
Description  Quad Micropower Operational Amplifier
PDF  8 Pages
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Site Internet  http://www.analog.com
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OP420 Fiches technique(HTML) 4 Page - Analog Devices

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REV. A
OP420
–4–
ORDERING GUIDE
Package Options
TA = 25
°C VOS Max (mV)
Cer DIP 14-Pin
LCC 20-Contact
Plastic
Operating Temperature Range
4.0
OP420CY
*
OP420CRC/883
MIL
4.0
OP420GP
*
XIND
4.0
OP420GS
*
XIND
*Not for new design; obsolete April 2002.
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±18 V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . .
±30 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . Supply Voltage
Output Short-Circuit Duration . . . . . . . . . . . . . . Continuous
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (One Amplifier Only)
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature Range (Soldering, 60 sec) . . . . . . . 300
°C
Operating Temperature Range
OP420CY, OP420CRC . . . . . . . . . . . . . . –55
°C to +125°C
OP420G . . . . . . . . . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Junction Temperature (TJ) . . . . . . . . . . . . . –65
°C to +150°C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the OP420 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
Package Type
JA
2
JC
Unit
14-Pin Hermetic DIP (Y)
99
12
°C/W
14-Pin Plastic DIP (P)
76
33
°C/W
16-Pin SOL (S)
92
27
°C/W
NOTES
1Absolute Maximum Ratings apply to packaged parts, unless otherwise noted.
2
JA is specified for worst-case mounting conditions, i.e.,
JA is specified for
device in socket for CerDIP and P-DIP packages; JA is specified for device
soldered to printed circuit board for SOL package.



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