| Moteur de recherche de fiches techniques de composants électroniques |
|
ADF4106BCPZ-R7 Fiches technique(PDF) 21 Page - Analog Devices |
|
|
|||||||||||||||||||||||||||||
ADF4106BCPZ-R7 Fiches technique(HTML) 21 Page - Analog Devices |
|
21 / 24 page ![]() Data Sheet ADF4106 Rev. E | Page 21 of 24 OUTLINE DIMENSIONS 16 9 8 1 PIN 1 SEATING PLANE 8° 0° 4.50 4.40 4.30 6.40 BSC 5.10 5.00 4.90 0.65 BSC 0.15 0.05 1.20 MAX 0.20 0.09 0.75 0.60 0.45 0.30 0.19 COPLANARITY 0.10 COMPLIANT TO JEDEC STANDARDS MO-153-AB Figure 25. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters 3.75 BCS SQ COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1 1 0.50 BSC PIN 1 INDICATOR 0.75 0.60 0.50 TOP VIEW 12° MAX 0.80 MAX 0.65 TYP SEATING PLANE PIN 1 INDICATOR COPLANARITY 0.08 1.00 0.85 0.80 0.30 0.23 0.18 0.05 MAX 0.02 NOM 0.20 REF 2.25 2.10 SQ 1.95 20 6 16 10 11 15 5 0.60 MAX 0.60 MAX 0.25 MIN FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. BOTTOM VIEW EXPOSED PAD 4.10 4.00 SQ 3.90 Figure 26. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 4 mm × 4 mm Body, Very Thin Quad (CP-20-1) Dimensions shown in millimeters |
|
Lien URL |
| ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Lien vers la fiche technique | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |