ADCMP564_15 datasheet(15/16 Pages) AD

15 / 16 page

ADCMP563/ADCMP564

Rev. C | Page 15 of 16

*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2

EXCEPT FOR EXPOSED PAD DIMENSION.

0.50

BSC

0.60 MAX

PIN 1

INDICATOR

1.50 REF

0.50

0.40

0.30

0.25 MIN

0.45

2.75

BSC SQ

TOP

VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

0.90

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

3.00

BSC SQ

*1.65

1.50 SQ

1.35

EXPOSED

PAD

BOTTOM VIEW

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

3 mm × 3 mm Body, Very Thin Quad

(CP-16-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Branding

ADCMP563BRQZ

−40°C to +85°C

16-Lead QSOP

RQ-16

ADCMP563BCPZ-R2

−40°C to +85°C

16-Lead LFCSP_VQ, 250 Unit Reel

CP-16-3

G01

ADCMP563BCPZ-RL7

−40°C to +85°C

16-Lead LFCSP_VQ, 1,500 Unit Reel

CP-16-3

G01

ADCMP563BCPZ-WP

−40°C to +85°C

16-Lead LFCSP_VQ, 50 Unit Waffle Pack

CP-16-3

G01

EVAL-ADCMP563BRQZ

Evaluation Board

ADCMP564BRQZ

−40°C to +85°C

20-Lead QSOP

RQ-20

EVAL-ADCMP564BRQZ

Evaluation Board

1 Z = RoHS Compliant Part.

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