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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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UPC1857ACT Fiches technique(PDF) 40 Page - NEC |
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UPC1857ACT Fiches technique(HTML) 40 Page - NEC |
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40 / 44 page  40 µµµµPC1857A 8. RECOMMENDED SOLDERING CONDITIONS It is recommended to solder this product under the conditions described below. For details of the recommended soldering conditions, refer to the Semiconductor Device Mounting Technology Manual (C10535E). For soldering methods and conditions other than those recommended, consult NEC. Soldering condition of through-hole type µµµµPC1857ACT: 30-pin plastic shrink DIP (400 mil) Soldering Method Soldering Condition Wave soldering (only pins) Soldering bath temperature: 260 °C MAX., Time: 10 seconds Partial heating Pin temperature: 300 °C MAX., Time: 3 seconds MAX. (per pin) Caution Apply wave soldering only to the pins, and exercise care that solder does not directly contact the package. |
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