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HCS373MS Fiches technique(PDF) 10 Page - Intersil Corporation |
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HCS373MS Fiches technique(HTML) 10 Page - Intersil Corporation |
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10 / 10 page ![]() 355 HCS373MS Die Characteristics DIE DIMENSIONS: 2747 x 2693 µm METALLIZATION: Type: SiAl Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: 2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 x 4 mils Metallization Mask Layout HCS373MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCS373 is TA14303A. OE (1) Q0 (2) D1 (4) Q1 (5) D2 (7) Q3 (9) GND (10) Q4 (12) (15) Q5 (16) Q6 (17) D6 (18) D7 Q7 (19) VCC (20) (14) D5 D0 (3) Q2 (6) (8) (11) D4 (13) D3 LE Spec Number 518845 |
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