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HCS273K Fiches technique(PDF) 9 Page - Intersil Corporation |
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HCS273K Fiches technique(HTML) 9 Page - Intersil Corporation |
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9 / 9 page ![]() 344 HCS273MS Die Characteristics DIE DIMENSIONS: 108 x 106 mils METALLIZATION: Type: AlSi Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 mils x 4 mils Metallization Mask Layout HCS273MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCS273 is TA14307B. MR (1) Q0 (2) D0 (3) VCC (20) Q7 (19) (18) D7 (17) D6 (16) Q6 (15) Q5 (14) D5 D1 (4) Q1 (5) Q2 (6) D2 (7) (8) (9) (10) D3 Q3 GND (11) CP (12) Q4 (13) D4 Spec Number 518767 |
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