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HCS166D Fiches technique(PDF) 9 Page - Intersil Corporation |
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HCS166D Fiches technique(HTML) 9 Page - Intersil Corporation |
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9 / 9 page ![]() 258 HCS166MS Die Characteristics DIE DIMENSIONS: 94 x 94 mils METALLIZATION: Type: AlSi Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 mils x 4 mils Metallization Mask Layout HCS166MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCS166 is TA14386A. DS (1) D0 D1 (3) (2) D2 (4) D3 (5) CE (6) (7) CP (8) GND (9) MR (10) D4 (11) D5 VCC (16) PE (15) (14) D7 (13) Q7 (12) D6 Spec Number 518758 |
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