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HCS161DMSR Fiches technique(PDF) 9 Page - Intersil Corporation |
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HCS161DMSR Fiches technique(HTML) 9 Page - Intersil Corporation |
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9 / 9 page ![]() 201 HCS161MS Die Characteristics DIE DIMENSIONS: 104 x 86 mils 2650 x 2190mm METALLIZATION: Type: AlSi Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 x 4 mils Metallization Mask Layout HCS161MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCS161 is TA14346A. CP MR VCC P0 (3) P1 (4) P2 (5) P3 (6) (9) (10) (11) Q3 (12) Q2 (13) Q1 (2) (1) (16) SPE TE (8) GND (14) Q0 PE (7) (15) TC Spec Number 518755 |
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