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LP38853 Fiches technique(PDF) 18 Page - Texas Instruments |
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LP38853 Fiches technique(HTML) 18 Page - Texas Instruments |
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18 / 27 page ![]() LP38853 SNVS335C – DECEMBER 2006 – REVISED SEPTEMBER 2011 www.ti.com Figure 36. Maximum Power Dissipation vs Ambient Temperature for the SO PowerPAD-8 Package Figure 36 shows the maximum allowable power dissipation for the SO PowerPAD-8 package for a range of ambient temperatures, assuming θJA is 98°C/W and the maximum junction temperature is 125°C. 18 Submit Documentation Feedback Copyright © 2006–2011, Texas Instruments Incorporated Product Folder Links: LP38853 |
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