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©2008 by RF Monolithics, Inc.

SC3041B - 3/27/08

Electrical Connections

Case Design

All pads consist of 30 microinches (min) electroless gold on 50 microinches

(min) electroless nickel over base metal. The metallic center pad was

designed for mechanical support. Grounding of this pad is optional.

Lid symbolization, including terminal 1 locator dot, are in contrasting ink.

Symbolization varies by model number. For purposes of illustration, only

terminal 1 dot is shown.

Footprint

Actual size footprint:

Typical Printed Circuit Board Land Pattern

A typical land pattern for a circuit board is shown below. Grounding of the

metallic center pad is optional.

.

Typical Test Circuit

Timing Definitions

1

2

3

4

8

7

6

5

TOP VIEW

A

B

N

J

L

(X2)

D

(X8)

K

(X8)

C

H

G

M

(X3)

E

F

Typically 0.01" to 0.05" or 0.25 mm to

1.25 mm (8 Places)

(The optimum value of this dimension is

dependent on the PCB assembly process

employed.)

Clock

Under Test

Q

Tektronix

CSA 803

Digitizing

Oscilloscope

Ch 2

ENABLE

Q

Ch 1

50

Ω

Trigger

*

*

*Power Splitter, Mini-Circuits ZFSC2-4

0.1

μF

Sine-Wave

Signal Generator

4.7

μH

50

Ω

50

Ω

t

PD

Propagation Delay:

50%

ENABLE

Q or Q Output

Amplitude

Envelope

50%

90%

10%

Symmetry:

50%

50%

Q or Q Output

50%

Symmetry as

% of Period

Period

Symmetry as

% of Period

t

PD

Terminal

Number

Connection

2

Ground

3

NC or Ground

4

Q Output

5

Q Output

6

Ground

7

8ENABLE

LID

Ground

Dimensions

Millimeters

Inches

Min

Max

Min

Max

A

13.46

13.97

0.530

0.550

B

9.14

9.66

0.360

0.380

C

2.05 Nominal

0.081 Nominal

D

3.56 Nominal

0.141 Nominal

E

2.24 Nominal

0.088 Nominal

F

1.27 Nominal

0.050 Nominal

G

2.54 Nominal

0.100 Nominal

H

3.05 Nominal

0.120 Nominal

J

1.93 Nominal

0.076 Nominal

K

5.54 Nominal

0.218 Nominal

L

4.32 Nominal

0.170 Nominal

M

4.83 Nominal

0.190 Nominal

N

0.50 Nominal

0.020 Nominal

Materials

Solder Pad Ter-

mination

Au plating 30 - 60 µinches (76.2-152 µm) over 80-200

µinches (203-508 µm) Ni.

Lid

Fe-Ni-Co Alloy Electroless Nickel Plate (8-11% Phos-

phorus) 100-200 µinches Thick

Body