• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macom.com for additional data sheets and product information.

M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or

information contained herein without notice.

V5

MA4SW510

ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for

development. Performance is based on target specifications, simulated results, and/or prototype

measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-

ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has

been fixed. Engineering samples and/or test data may be available. Commitment to produce in

volume is not guaranteed.

HMIC™ Silicon SP5T PIN Diode Switch

RoHS Compliant

ASSEMBLY INSTRUCTIONS

Cleanliness: The chips should be handled in a clean environment free of dust and organic contamination.

Electro-Static Sensitivity: The MA4SW510 PIN diode switch is ESD sensitive and proper precautions should be

taken to avoid damaging the chip. ESD rating is Class 0 (HBM) and Class C1 (CDM).

Wire / Ribbon Bonding: Thermosonic wedge bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold

downward force of 18 to 22 grams should be used. If ultrasonic energy is necessary, it should be adjusted to the

minimum level required to achieve a good bond. Excessive power or force will fracture the silicon beneath the

bond pad causing it to lift. RF bond wires and ribbons should be kept as short as possible for optimum RF

performance.

Chip Mounting: HMIC switches have Ti-Pt-Au backside metallization and can be mounted using a gold-tin

eutectic solder or conductive epoxy. Mounting surface must be free of contamination and flat.

Eutectic Die Attachment: 80/20, gold-tin, solder is recommended. A re-flow oven or hot gas die bonder with a

required for attachment. RoHS compliant solders may also be used but solders rich in tin should be avoided as

they will scavenge the backside gold and/or cause gold embrittlement.

Epoxy Die Attachment: A minimum amount of epoxy, 1–2 mils thick, should be used to attach chip. A thin epoxy

fillet should be visible around the outer perimeter of the chip after placement. Epoxy cure time is typically 1 hour

at 150°C.