Moteur de recherche de fiches techniques de composants électroniques
  French  ▼
ALLDATASHEET.FR

X  

Preview PDF HTML

STPS1L60 Fiches technique(PDF) 4 Page - STMicroelectronics

No de pièce STPS1L60
Description  Power Schottky rectifier
PDF  10 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STPS1L60 Fiches technique(HTML) 4 Page - STMicroelectronics

  STPS1L60 Datasheet HTML 1Page - STMicroelectronics STPS1L60 Datasheet HTML 2Page - STMicroelectronics STPS1L60 Datasheet HTML 3Page - STMicroelectronics STPS1L60 Datasheet HTML 4Page - STMicroelectronics STPS1L60 Datasheet HTML 5Page - STMicroelectronics STPS1L60 Datasheet HTML 6Page - STMicroelectronics STPS1L60 Datasheet HTML 7Page - STMicroelectronics STPS1L60 Datasheet HTML 8Page - STMicroelectronics STPS1L60 Datasheet HTML 9Page - STMicroelectronics Next Button
Zoom Inzoom in Zoom Outzoom out
 4 / 10 page
background image
Characteristics
STPS1L60
4/10
Doc ID 7504 Rev 8
Figure 7.
Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMA)
Figure 8.
Non repetitive surge peak forward
current versus overload duration
(maximum values) (DO-41)
0
1
2
3
4
5
6
7
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
Ta = 25 °C
Ta = 75 °C
Ta = 125 °C
SMA
IM
t
δ = 0.5
IM(A)
t(s)
0
2
3
4
5
6
7
8
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
IM(A)
IM
t
δ = 0.5
1
DO-41
Ta = 25 °C
Ta = 75 °C
Ta = 125 °C
t(s)
Figure 9.
Non repetitive surge peak forward
current versus overload duration
(maximum values) (STmite flat)
Figure 10.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
0
2
4
6
8
10
12
14
16
18
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
Tc = 25 °C
Tc = 75 °C
Tc = 125 °C
t(s)
IM
t
δ = 0.5
IM(A)
STmite flat
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Zth(j-a)/Rth(j-a)
tp(s)
Single pulse
SMA
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
Figure 11.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (DO-41)
Figure 12.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (STmite flat)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Single pulse
DO-41
Zth(j-a)/Rth(j-a)
tp(s)
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Zth(j-a)/Rth(j-a)
Single pulse
tp(s)
STmite flat
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout



Html Pages

1 2 3 4 5 6 7 8 9 10


Fiches technique Télécharger

Go To PDF Page


Lien URL



ALLDATASHEET vous a-t-il été utile ?  [ DONATE ] 

À propos de Alldatasheet   |   Publicité   |   Contactez-nous   |   Politique de confidentialité   |   Lien vers la fiche technique    |   Echange de liens   |   Fabricants
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com